Solved: rme point patches still valid ?

Martin Ermel · ‎05-23-2008

is it correct, that the following point patches for RME are not necessary with the latest updates of the RME device packages (RME 4.1.1) ?

rme4.1.1-sol-CSCsm078321.0.tar

rme4.1.1-sol-CSCsm52760,CSCsl543231.0.tar

I assume so because there are newer packages available in the regular download area as they are integrated by the patches.

Joe Clarke · ‎05-23-2008

We call our quarterly device support updates IDUs (Incremental Device support Updates). IDUs come in one of two forms depending on the application. For RME and CS, they arei n the form of modular packages (device packages for RME and an MDF package for CS). For Campus and DFM, which do not support modular device packages, we ship Service Packs. The advantage of that approach is that we can slip in bug fixes along with device support.

As the number of bugs increase, we also release bundle service packs (like we did for LMS 2.6). These usually coincide with an IDU, but instead of releasing device packages for RME and CS, we release an SP which also contains bug fixes.

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Joe Clarke · ‎05-23-2008

If you have RME 4.1.1 with IDU 20.0 (the April package release), then these point patches are no longer required.

Martin Ermel · ‎05-23-2008

thanks for that quick reply. That's what I thought it would be.

IDU - I have heard that old name for device package updates a few times in the past from Cisco employees - even when they where talking about LMS 2.5 or LMS 3.x. So it seems to be still alive internally... It is a pity that it does not exist externally anymore as it was a quick and easy way to determine the patch level of an installation (in regard to the device pkgs).

Are there any plans to bring this back into the software - or is this just not possible as the process for updating device pkgs changed (from the point of view of the customer and the LMS software)?

Joe Clarke · ‎05-23-2008

We call our quarterly device support updates IDUs (Incremental Device support Updates). IDUs come in one of two forms depending on the application. For RME and CS, they arei n the form of modular packages (device packages for RME and an MDF package for CS). For Campus and DFM, which do not support modular device packages, we ship Service Packs. The advantage of that approach is that we can slip in bug fixes along with device support.

As the number of bugs increase, we also release bundle service packs (like we did for LMS 2.6). These usually coincide with an IDU, but instead of releasing device packages for RME and CS, we release an SP which also contains bug fixes.