I need your help with the following design:
Right now we are working in a design for one of our customers, and we want to offer them 2 6504-E, with the Virtual Switching Technology.
These are the components:
- (2) Switches 6504-E, each switch includes: (1) VS-S720-10G-3C and (1) WS-X6708-10G-3C
- (9) Switches WS-C3750X-24P-L
The 9 3750X Switches are going to be divided in 3 groups of 3 Switches 3750X(see attached diagram). We want to stack the 3 3750X Switches using the Stackwise technology that these switches support.
Like the diagram shows, we also want to connect the first 3750X of each group to VSS Switch 1, and the last 3750X of each group to VSS Switch 2. The connection will be using the WS-X6708-10G-3C cards.
The idea is to have redundancy using Multichassis Etherchannel (MEC), from the VSS Switch 1 and VSS Switch 2 to the Switches in the stack. Is possible to have this type of redundancy? If VSS Switch 1 or the first switch in the stack fails, then VSS Switch 2 will keep communication with the last switch of the stack.
If you have any comments or suggestions, please let me know.
Thanks a lot for your help.
LACP is supported on the cross stack etherchannel
Actually also PAGP is supported, what is not supported is Enhanced PAGP that would be required to implement dual active detection with the help of a third party switch.
As I wrote in my previous post I prefer to have a dedicated direct link between the two VSS members rather then relying on a third party switch.
In your case if PAGP+ is not supported on the C3750X you need to use BFD or fast hello
PAGP and LACP are both supported in C3750 stacks, but LACP can be preferred as being standard based
see the section named etherchannels and stacks
Hope to help